Job Description :
Technical Program Manager/Sr. Application Engineer
Location: Sunnyvale, CA
Duration: 6 Months Contract To Hire




This position is Technical Program Manager and/or Sr. Application Engineer for semiconductor and electronic industry packaging, assembly and field engineering support.
The person needs sound knowledge semiconductor IC packaging technology, design, process, test and failure analysis. Good foundation in IC, component, module and PCB development and product engineering knowledge.
Will need to work directly with semiconductor and OEM customer, align with internal team on new product introduction, new technology promotion, NPI project management and MP ramp support.


ESSENTIAL DUTIES AND RESPONSIBILITIES include the following, other duties may be assigned:

Front line interface with customer on engineering inquiry, provide timely response and viable solution as local technical support.
Work with customer on internal team on the new product introduction from design, simulation, assembly process, tooling/equipment, manufacturability, qualification and test.
Be problem solver and perform crisis management. Identify scale of issues, drive root cause analysis, implement corrective action, and monitor performance
Collaborate with all supply chain partner on technical issues from component, IC, packaging, module and PCB interface.
Technical Program management of new product introduction, schedule, business alignment with sales, HVM ramp ensure time to market
Support MP field engineering issues, including major yield and quality crisis and customer RMA.
Participate in new business promotion, engagement, capital expenditure, product launch risk assessment.


Supervisory Roles: No supervisory role needed



EDUCATION and/or EXPERIENCE:

BA or MS in engineering, minimum 5 years’ experience in electronic manufacturing industry, prior knowledge in IC package, Module and PCB field.
Good interpersonal skills.
Excellent in written English and verbal communication.
Bilingual in Chinese and English is a plus.


COMPUTER/SOFTWARE SKILLS/KNOWLEDGE:

Proficient in MS Office, AutoCAD viewer, Cadence package design, layout tool experience are a plus.