Job Description :
HDI and High-speed boards designing and impedance controlled stack-up designing.
Fine pitch BGA routing, Blind - Buried via and ALIVH technology PCB Designing.
Demonstrable experience of PCB design of multi-layer Analog, Digital and RF layouts designs.
Impedance control stack-up designing and Signal/Power integrity analysis.
Hands on DDRx, PCI-X, USB 3.0, ETHERNET, and WLAN etc… based boards design.
Understanding of PCB design constraints, including Trace length matching Constraints, Impedance control and spacing rules.
Experience on designing Flexi - Rigid and Flexi PCBs.
Create / Maintain Schematic symbols, PCB Footprint symbols and PLM CIS/SQL library.
Extensive knowledge on Altium Tools (preferred) and Cadence.
Understanding of PCB Fabrication process and DFA, DFM & DFT requirements.
In-depth knowledge of IPC standards. (IPC-7351A, IPC-2221) and IPC certification is Plus.
Familiar with Windchill or Agile PLM products and supports.